141/143 Series
Numeric Display/Case Size 12.5 x 19.0 mm
TTW (Through The Wave) soldering Conditions
Pre-heating
100 ℃
60 s
(MAX.) Resin surface temperature
(MAX.)
Solder Bath Temp.
Dipping Time
265 ℃
5s
(MAX.)
(MAX.)
Position
At least 1.7 mm away from case body
1) The dip soldering process shall be 2 times maximum.
2) The product shall be cooled to normal temperature before the second dipping process.
Manual Soldering Conditions
Iron tip temp.
Soldering time and frequency
Position
400 ℃ (MAX.) (30 W Max.)
3s
(MAX.)
2 times (MAX.)
At least 1.7 mm away from case body
2004.12.22
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