CXL5502M データシートの表示（PDF） - Sony Semiconductor

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CXL5502M

CMOS-CCD 1H Delay Line for NTSC

Sony Semiconductor 

CXL5502N

16PIN SSOP (PLASTIC)

∗5.0 ± 0.1

16

9

A

+ 0.2

1.25 – 0.1

0.1

1

+ 0.1

0.22 – 0.05

8

0.65

0.13 M

+ 0.05

0.15 – 0.02

0.1 ± 0.1

0° to 10°

DETAIL A

NOTE: Dimension “∗” does not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

SSOP-16P-L01

SSOP016-P-0044

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER / PALLADIUM

PLATING

42/COPPER ALLOY

0.1g

CXL5502P

+ 0.4

19.2 – 0.1

14PIN DIP (PLASTIC)

14

8

1

7

2.54

0° to 15°

CXL5502M/N/P

0.5 ± 0.1

1.2 ± 0.15

SONY CODE

EIAJ CODE

JEDEC CODE

DIP-14P-01

DIP014-P-0300

Similar to MO-001-AH

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

EPOXY RESIN

SOLDER PLATING

LEAD MATERIAL

42/COPPER ALLOY

PACKAGE MASS

0.9g

– 13 –

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