Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
AVDD to AGND
IOVDD to DGND
ADCVDD to AGND
DVDD to DGND
REFIN/REFOUT to REFGND
ECG and Analog Inputs to AGND
Digital Inputs to DGND
REFIN to ADCVDD
AGND to DGND
REFGND to AGND
ECG Input Continuous Current
Storage Temperature Range
Operating Junction Temperature Range
Reflow Profile
Junction Temperature
ESD
HBM
FICDM
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +2.5 V
−0.3 V to +2.5 V
−0.3 V to +2.1 V
−0.3 V to AVDD + 0.3 V
−0.3 V to IOVDD + 0.3 V
ADCVDD + 0.3 V
−0.3 V to + 0.3 V
−0.3 V to + 0.3 V
±10 mA
−65°C to +125°C
−40°C to +85°C
J-STD 20 (JEDEC)
150°C max
2500 V
1000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADAS1000/ADAS1000-1/ADAS1000-2
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance1
Package Type
θJA
56-Lead LFCSP
35
64-Lead LQFP
42.5
Unit
°C/W
°C/W
1 Based on JEDEC standard 4-layer (2S2P) high effective thermal conductivity
test board (JESD51-7) and natural convection.
ESD CAUTION
Rev. A | Page 13 of 80