KSTW002A5B41-SRZ データシートの表示（PDF） - General Semiconductor
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KSTW002A5B41-SRZ Datasheet PDF : 16 Pages
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GE
Data Sheet
KSTW002A5B Barracuda* Series; DC-DC Converter Power Modules
36-75Vdc Input; 12Vdc, 2.5A Output
Feature Descriptions (continued)
Radjup
5.11Vo,set (100
1.225 %
%)
511
%
10.22 k
Where
%
Vo,desired Vo,set
Vo , set
100
Figure 12. Circuit Configuration to Increase Output Voltage.
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be provided
to help ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability.
The thermal data presented here is based on physical
measurements taken in a wind tunnel, using automated
thermo-couple instrumentation to monitor key component
temperatures: FETs, diodes, control ICs, magnetic cores,
ceramic capacitors, opto-isolators, and module pwb
conductors, while controlling the ambient airflow rate and
temperature. For a given airflow and ambient temperature, the
module output power is increased, until one (or more) of the
components reaches its maximum derated operating
temperature, as defined in IPC-9592A. This procedure is then
repeated for a different airflow or ambient temperature until a
family of module output derating curves is obtained.
The combination of the output voltage adjustment and the
output voltage initial tolerance must not exceed the allowable
trim range of 80% to 110% of the nominal output voltage as
measured between the Vout+ and Vout- pins.
The KSTW002A5B power modules have a fixed current-limit set
point. Therefore, as the output voltage is adjusted down, the
available output power shall be reduced.
Pre-bias Vin Under Voltage Test
The module shall recover from UVLO [Under Voltage Lock Out]
without protective shutdown from OCP or OVP or hard failure,
when subjected to Vin Under Voltage transients with the
following conditions:
Vin(V)
48
48
48
48
48
48
48
48
60
60
60
60
60
60
60
60
Tdip (ms)
5
5
10
10
5
5
10
10
5
5
10
10
5
5
10
10
Co (uF)
0
2200
0
2200
0
2200
0
2200
0
2200
0
2200
0
2200
0
2200
Load (A)
0
0
0
0
2.5
2.5
2.5
2.5
0
0
0
0
2.5
2.5
2.5
2.5
Vin
Tfall = 10us
5V
Tdip
Trise = 5us
Figure 13. Thermal Test Setup.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer
via convection. Derating figures showing the maximum output
current that can be delivered by each module versus local
ambient temperature (TA) for natural convection and up to
3m/s (600 ft./min) are shown in the respective Characteristics
Curves section.
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
September 26, 2013
©2013 General Electric Corporation. All rights reserved.
Page 8
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