NXP Semiconductors
14. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
HEF4585B
4-bit magnitude comparator
SOT38-4
D
L
Z
e
b
16
pin 1 index
A2 A
A1
wM
b1
b2
9
ME
c
(e 1)
MH
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches 0.17
0.02
0.13
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT38-4
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
Fig 7. Package outline 38-4 (DIP16)
HEF4585B_4
Product data sheet
Rev. 04 — 10 August 2009
© NXP B.V. 2009. All rights reserved.
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