MPXHZ6130A6U データシートの表示（PDF） - Freescale Semiconductor

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MPXHZ6130A6U

Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate

boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.150

3.81

0.050

1.27

TYP

0.387

9.83

0.027 TYP 8X

0.69

0.053 TYP 8X inch

1.35

mm

Figure 5. SSOP Footprint (Case 1317 and 1317A)

PACKAGE DIMENSIONS

MPXHZ6130A

6

CASE 1317-04

ISSUE F

SUPER SMALL OUTLINE PACKAGE

Sensors

Freescale Semiconductor

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