MMBTA05LT3G(2005) データシートの表示（PDF） - ON Semiconductor
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MMBTA05LT3G Datasheet PDF : 6 Pages
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MMBTA05LT1, MMBTA06LT1
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AL
D
3
E HE
1
2
e
A
b
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
L
C
MILLIMETERS
DIM MIN
NOM MAX
A 0.89
1.00
1.11
A1 0.01
0.06
0.10
b
0.37
0.44
0.50
c
0.09
0.13
0.18
D
2.80
2.90
3.04
E
1.20
1.30
1.40
e
1.78
1.90
2.04
L
0.35
0.54
0.69
H E 2.10
2.40
2.64
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.014
0.083
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.029
0.104
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
0.9
0.035
2.0
0.079
0.8
0.031
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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