MCL4448 データシートの表示（PDF） - Micro Commercial Components
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MCL4448 Datasheet PDF : 4 Pages
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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MCL4448
Features
• Silicon epitaxial planar diode
• Fast Switching diodes
• 500mW power dissipation
• This diode is also available in the DO-35 case with the type
500mW 100 Volt
designation 1N4448, in the Minimelf case with the type designation Silicon Epitaxial Diode
DL4448
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Maximum Ratings
• Operating Temperature: -55OC to +150 OC
• Storage Temperature: -55OC to +150OC
• Maximum Thermal Resistance; 350K/W Junction To Ambient
• Epoxy meets UL 94 V-0 flammability rating
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1
25OC
Unless
Otherwise
Specified
Reverse Voltage
Peak Reverse
Voltage
VR
75V
VRM
100V
Average Rectified
Current
IAV
Power Dissipation
PTOT
Junction Temperature
TJ
Surge Forward
Current
IFSM
Instantaneous
VF
Forward Voltage
Maximum DC
Reverse Current At
IR
Rated DC Blocking
Voltage
150mA
500mW1)
150OC
Resistive Load
f > 50Hz
TA=25OC
500mA t<1S, TJ=25OC
1.0V(MAX)
0.62-0.72V
25nA
5.0uA
50uA
IFM = 100mA;
IFM = 5.0mA
TJ=25OC, VR=20V
VR=75V,
VR=20V TJ=150OC
Minimum Reverse
Breakdown Voltage
V(BR)R
100V
Tested with
100uA puse
Typical Junction
Capacitance
CJ
4.0pF
Measured at
VR=VF=0V
Reverse Recovery
Time
IF=10mA,
Trr
4.0nS VR = 6.0V
RL=100OHMS
1) Valid provided that leads at a distance of 8mm from case are kept
at ambient temperature(DO-35)
Note: 1. Lead in Glass Exemption Applied, see EU Directive Annex 5.
MICROMELF
Cathode Mark
C
B
A
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.071
.079
B
.004
.008
C
.047
.051
MM
MIN
1.8
.10
1.20
MAX
2.0
.20
1.30
NOTE
∅
SUGGESTED SOLDER
PAD LAYOUT
0.039
0.055”
0.030”
Revision: A
www.mccsemi.com
2011/01/01
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