HEF4013BTT データシートの表示（PDF） - NXP Semiconductors.
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HEF4013BTT Datasheet PDF : 16 Pages
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NXP Semiconductors
14. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
HEF4013B
Dual D-type flip-flop
SOT27-1
D
L
Z
e
b
14
pin 1 index
A2 A
A1
wM
b1
8
ME
c
(e 1)
MH
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.2
inches
0.17
0.02
0.13
0.068 0.021 0.014
0.044 0.015 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT27-1
IEC
050G04
REFERENCES
JEDEC
JEITA
MO-001
SC-501-14
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 10. Package outline SOT27-1 (DIP14)
HEF4013B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
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