ZXMP10A18G
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current (c)
@ VGS=10V; TA=25°C (b)
@VGS=10V; TA=70°C (b)
@ VGS=10V; TA=25°C (a)
Continuous Source Current (Body Diode) (b)
Pulsed Source Current (Body Diode) (c)
Power Dissipation at TA=25°C (a)
Linear Derating Factor
Power Dissipation at TA=25°C (b)
Linear Derating Factor
Operating and Storage Temperature Range
SYMBOL
VDSS
VGS
ID
IDM
IS
ISM
PD
PD
Tj, Tstg
LIMIT
-100
±20
-3.7
-3.0
-2.6
-16.5
-5.3
-16.5
2
16
3.9
31
-55 to +150
UNIT
V
V
A
A
A
A
A
A
W
mW/°C
W
mW/°C
°C
THERMAL RESISTANCE
PARAMETER
Junction to Ambient (a)
Junction to Ambient (b)
SYMBOL
R⍜JA
R⍜JA
VALUE
62.5
32.2
UNIT
°C/W
°C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t Յ 10 sec.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.02 pulse width = 300s - pulse width limited by maximum junction temperature.
SEMICONDUCTORS
2
ISSUE 1 - MARCH 2005