ZXMP10A17E6
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @ VGS=10V; TA=25°C (b)
@ VGS=10V; TA=70°C (b)
@ VGS=10V; TA=25°C (a)
Pulsed Drain Current (c)
Continuous Source Current (Body Diode) (b)
Pulsed Source Current (Body Diode) (c)
Power Dissipation at TA=25°C (a)
Linear Derating Factor
VDSS
VGS
ID
IDM
IS
ISM
PD
Power Dissipation at TA=25°C (b)
PD
Linear Derating Factor
Operating and Storage Temperature Range
Tj, Tstg
LIMIT
-100
±20
-1.6
-1.3
-1.3
-7.7
-2.1
-7.7
1.1
8.8
1.7
13.6
-55 to +150
UNIT
V
V
A
A
A
A
W
mW/°C
W
mW/°C
°C
THERMAL RESISTANCE
PARAMETER
Junction to Ambient (a)
Junction to Ambient (b)
SYMBOL
RθJA
RθJA
VALUE
113
73
UNIT
°C/W
°C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
(b) For a device surface mounted on FR4 PCB measured at tр5 secs.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.02, pulse width 300s - pulse width limited by maximum junction temperature. Refer to
Transient Thermal Impedance graph.
SEMICONDUCTORS
ISSUE 2 - SEPTEMBER 2005
2