TGL6425-SCC データシートの表示（PDF） - TriQuint Semiconductor
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TGL6425-SCC Datasheet PDF : 7 Pages
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TGL6425-SCC
MECHANICAL DRAWING
1,8288 (0.0720)
1,6358 (0.0644)
2
3
4
5
6
1,0592 (0.0417)
1
7
1,0592 (0.0417)
0,1880 (0.0074)
0.0
12
11
10
9
8
Units: Millimeters (inches)
Thickness: 0,102 (0.004) (reference only)
Chip edge to bond pad dimensions are shown to center of bond pad.
Chip size ±0,0508 (0.002)
Bond pad #1 (RF In): 0,127 x 0,207 (0.0050 x 0.0082)
Bond pad #2 (V1):
Bond pad #3 (V3):
Bond pad #4 (V2):
Bond pad #5 (V5):
Bond pad #6 (V10):
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #7 (RF Out): 0,246 x 0,119 (0.0097 x 0.0047)
Bond pad #8 (V4):
Bond pad #9 (V7):
Bond pad 1#0 (V6):
Bond pad #11 (V8):
Bond pad #12 (V9):
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
6
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