VNQ830 データシートの表示（PDF） - STMicroelectronics

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VNQ830

Quad channel high-side driver

STMicroelectronics 

Package and PCB thermal data

4

Package and PCB thermal data

4.1

SO-28 thermal data

Figure 27. SO-28 PC board

VNQ830

Obsolete Product(s) - Obsolete Product(s) Note:

Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB

thickness = 2mm, Cu thickness = 35µm, Copper areas: 0.5 cm2, 3 cm2, 6 cm2).

Table 16. Thermal calculation according to the PCB heatsink area

Chip 1 Chip 2

Tjchip1

Tjchip2

Note

ON

OFF

ON

ON

OFF

ON

ON

ON

RthA x Pdchip1 + Tamb

RthC x Pdchip2 + Tamb

RthB x (Pdchip1 + Pdchip2) +

Tamb

(RthA x Pdchip1) + RthC x

Pdchip2 + Tamb

RthC x Pdchip1 + Tamb

RthA x Pdchip2 + Tamb

RthB x (Pdchip1 + Pdchip2) +

Tamb

(RthA x Pdchip2) + RthC x

Pdchip1 + Tamb

Pdchip1 = Pdchip2

Pdchip1 ≠ Pdchip2

RthA = thermal resistance junction to ambient with one chip ON

RthB = thermal resistance junction to ambient with both chips ON and Pdchip1 = Pdchip2

RthC = mutual thermal resistance

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Doc ID 7390 Rev 5

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