RT9173CGSP データシートの表示（PDF） - Richtek Technology
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RT9173CGSP Datasheet PDF : 13 Pages
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RT9173C
infinitely and avoid the tin overflow. We use the “dog-bone”
copper patterns on the top layer as Figure 9.
As shown in Figure 10, the amount of copper area to which
the SOP-8 (Exposed Pad) is mounted affects thermal
performance. When mounted to the standard SOP-8
(Exposed Pad) pad of 2 oz. copper (Figure 10.a), θJA is
75°C/W. Adding copper area of pad under the SOP-8
(Exposed Pad) (Figure 10.b) reduces the θJA to 64°C/W.
Even further, increasing the copper area of pad to 70mm2
(Figure 10.e) reduces the θJA to 49°C/W.
Figure 10 (a). Minimum Footprint, θJA = 75°C/W
100
90
80
70
60
50
40
30
0
θJA vs. Copper Area
10 20 30 40 50 60 70
Copper Area (mm2)
Figure 8
Figure 10 (b). Copper Area = 10mm2, θJA = 64°C/W
Figure 10 (c). Copper Area = 30mm2, θJA = 54°C/W
Exposed Pad
W≦2.28mm
Figure 10 (d). Copper Area = 50mm2, θJA = 51°C/W
Figure 9.Dog-Bone layout
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Figure 10 (e). Copper Area = 70mm2, θJA = 49°C/W
Figure 10. Thermal Resistance vs. Different Cooper Area
Layout Design
DS9173C-12 September 2007
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