R6
C1
C19A
R3
R5T
R4
R2A
R7A
L5
C2
L6
L3A
C18A
C3A
R1A
C4 C5
C6
L4
C3B
C7 C8
R1B
C16A
C17A
L1A
L2 C12
C15
C14A
C9 C10 C11
L1B
C13
C14B
C18B
R7B
L3B
R2B
C16B
C17B
C19B
MRF373S
Vertical Balun Mounting Detail
Output 2
(12.5 ohm microstrip)
Output 1
(12.5 ohm microstrip)
Motorola Vertical 660 MHz Balun
Rogers RO3010 (50 mil thick)
PCB Substrate (30 mil thick)
Note:
Trim Balun PCB so that a 35 mil “tab”
fits into the main PCB “slot” resulting
in Balun solder pads being level with
the PCB substrate solder pads when
fully inserted.
Ground
Input
(50 ohm microstrip)
55 mil slot cut
out to accept Balun
Figure 10. MRF373S Broadband Push–Pull Component Layout
MOTOROLA WIRELESS SEMICONDUCTOR
SOLUTIONS – RF AND IF DEVICE DATA
MRF373 MRF373S
7