PK20FN32VMF12 データシートの表示（PDF） - Freescale Semiconductor

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PK20FN32VMF12

K20 Sub-Family

Freescale Semiconductor 

5.4.1 Thermal operating requirements

Table 11. Thermal operating requirements

Symbol

TJ

TA

Description

Die junction temperature

Ambient temperature

Min.

–40

–40

Max.

125

105

General

Unit

°C

°C

5.4.2 Thermal attributes

Board type

Single-layer

(1s)

Symbol

RθJA

Four-layer

(2s2p)

RθJA

Single-layer

(1s)

RθJMA

Four-layer

(2s2p)

RθJMA

—

RθJB

—

RθJC

—

ΨJT

Description 81 MAPBGA

Thermal

65

resistance,

junction to

ambient (natural

convection)

Thermal

36

resistance,

junction to

ambient (natural

convection)

Thermal

52

resistance,

junction to

ambient (200 ft./

min. air speed)

Thermal

31

resistance,

junction to

ambient (200 ft./

min. air speed)

Thermal

17

resistance,

junction to

board

Thermal

13

resistance,

junction to case

Thermal

3

characterization

parameter,

junction to

package top

outside center

(natural

convection)

80 LQFP

50

35

39

29

19

8

2

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Notes

1

1

1

1

2

3

4

1.

Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method

Environmental Conditions—Forced Convection (Moving Air).

2.

Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental

Conditions—Junction-to-Board.

K20 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.

Freescale Semiconductor, Inc.

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