MAX8588 データシートの表示（PDF） - Maxim Integrated

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MAX8588

High-Efficiency, Low-IQ PMIC with Dynamic Core for PDAs and Smartphones

Maxim Integrated 

High-Efficiency, Low-IQ PMIC with

Dynamic Core for PDAs and Smartphones

ABSOLUTE MAXIMUM RATINGS

IN, IN45, IN6, MR, LBO, DBO, RSO, POK, SCL, SDA,

BKBT, V7, SLP, SRAD, PWM3 to GND...............-0.3V to +6V

REF, CC_, ON_, FB_, DBI, LBI, V1, V2, RAMP, BYP,

MR to GND ...........................................-0.3V to (VIN + 0.3V)

PV1, PV2, PV3, SLPIN to IN...................................-0.3V to +0.3V

V4, V5 to GND ..........................................-0.3V to (VIN45 + 0.3V)

V6 to GND ..................................................-0.3V to (VIN6 + 0.3V)

PV1 to PG1 ............................................................-0.3V to +6.0V

PV2 to PG2 ............................................................-0.3V to +6.0V

PV3 to PG3 ............................................................-0.3V to +6.0V

LX1 Continuous Current....................................-1.30A to +1.30A

LX2 Continuous Current........................................-0.9A to +0.9A

LX3 Continuous Current........................................-0.5A to +0.5A

PG1, PG2, PG3 to GND.........................................-0.3V to +0.3V

V1, V2, V4, V5, V6 Output Short-Circuit Duration.......Continuous

Continuous Power Dissipation (TA = +70°C)

6mm x 6mm 48-Pin Thin QFN

(derate 26.3mW/°C above +70°C) ...........................2105mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VIN = 3.6V, VBKBT = 3.0V, VLBI = 1.1V, VDBI = 1.35V, circuit of Figure 5, TA = 0°C to +85°C, unless otherwise noted. Typical values

are at TA = +25°C.)

PARAMETER

CONDITIONS

MIN TYP MAX UNITS

PV1, PV2, PV3, SLPIN, IN Supply

PV1, PV2, PV3, IN, and SLPIN must connect together

2.6

Voltage Range

externally

5.5

V

IN45, IN6 Supply Voltage Range

IN Undervoltage-Lockout (UVLO)

Threshold

VIN rising

VIN falling

Only V7 on, VIN = 3.0V

2.4

5.5

V

2.25 2.40 2.55

V

2.200 2.35 2.525

32

Quiescent Current

No load (IPV1 +

REG1 and REG2 on in switch mode,

IPV2 + IPV3 + IIN + REG3 off

130

ISLPIN + IIN45 +

IIN6)

REG1 and REG2 on in sleep mode,

REG3 off

60

µA

All REGs on

BKBT Input Current

ON1 = 0

ON1 = IN

REF Output Voltage

0 to 10µA load

SYNCHRONOUS-BUCK PWM REG1

REG1 Voltage Accuracy

FB1 = GND, 3.6V ≤ VPV1 ≤ 5.5V, load = 0 to 1300mA

FB1 Voltage Accuracy

FB1 used with external resistors, 3.6V ≤ VPV1 ≤ 5.5V,

load = 0 to 1300mA

225

4

µA

0.8

1.2375 1.25 1.2625 V

3.25 3.3 3.35

V

1.231 1.25 1.269 V

FB1 Input Current

Error-Amplifier Transconductance

Dropout Voltage (Note 1)

FB1 used with external resistors

Referred to FB

Load = 800mA

Load = 1300mA

100

nA

87

µS

180 280

mV

293 450

2 _______________________________________________________________________________________

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