MAX7370 データシートの表示（PDF） - Maxim Integrated
部品番号
コンポーネント説明
メーカー
MAX7370 Datasheet PDF : 37 Pages
| |||
MAX7370
8 x 8 Key-Switch Controller and LED Driver/GPIOs
with I2C Interface and High Level of ESD Protection
ABSOLUTE MAXIMUM RATINGS
VCC, VLA to GND.....................................................-0.3V to +4V
COL3–COL0, ROW7–ROW0 to GND........ -0.3V to (VCC + 0.3V)
COL7–COL4 to GND...............................................-0.3V to +6V
SDA, SCL, AD0, INT to GND...................................-0.3V to +6V
VLA to VCC............................................................-0.3V to +2.3V
DC Current on COL7–COL4 to GND..................................25mA
DC Current on COL3–COL0, ROW7–ROW0 to GND...........7mA
VCC, VLA, GND Current......................................................80mA
DC Current VCC, VLA to COL3–COL0, ROW7–ROW0.........5mA
Continuous Power Dissipation (TA = +70°C)
24-Pin TQFN (derate 15.4mW/°C above +70°C).......1229mW
25-Bump WLP (derate 19.2mW/°C above +70°C)......850mW
Operating Temperature Range........................... -40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range............................ -65°C to +150°C
Lead Temperature (TQFN) (soldering, 10s)....................+300°C
Soldering Temperature (reflow).......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
24 TQFN
Junction-to-Ambient Thermal Resistance (BJA).........65.1°C/W
Junction-to-Case Thermal Resistance (BJC)................5.4°C/W
25 WLP
Junction-to-Ambient Thermal Resistance (BJA)...........52°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VCC = 1.62V to 3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = 3.3V, TA = +25NC.) (Notes 2, 3)
PARAMETER
Operating Supply Voltage
Second Logic Supply
Operating Supply Current
SYMBOL
VCC
VLA
ICC
CONDITIONS
All key switches open, oscillator
running
N keys pressed
MIN
TYP MAX
1.62
3.3
3.6
VCC
3.3
3.6
50
65
50 + 28 O N
UNITS
V
V
FA
Sleep-Mode Supply Current
POR Threshold
KEY-SWITCH SPECIFICATIONS
Key-Switch Source Current
Key-Switch Source Voltage
Key-Switch Resistance
Startup Time from Sleep
GPIO SPECIFICATIONS
External Supply Voltage
COL7–COL4 (LED Drivers)
LED Port-to-Port Sink Current Variation
ISL
VPOR
Not using GPO or LED configuration
IKEY
VKEY
RKEY
tSTART
(Note 4)
VLED
VCC = 3.3V, VOL = 1V, TA = +25NC,
10mA output mode
1.8
3
FA
1.2
V
28
40
FA
0.45
0.5
V
5
kI
2
2.7
ms
5
V
Q1.5 Q2.4
%
����������������������������������������������������������������� Maxim Integrated Products 2
Share Link: 