MAX6403BS41-T データシートの表示（PDF） - Maxim Integrated
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MAX6403BS41-T Datasheet PDF : 9 Pages
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µP Supervisory Circuits in 4-Bump (2 ✕ 2)
Chip-Scale Package
Table 2. Device Marking Codes
PARTS
MAX6400BS31-T
MAX6400BS30-T
MAX6400BS29-T
MAX6400BS28-T
MAX6400BS27-T
MAX6400BS26-T
MAX6400BS25-T
MAX6400BS24-T
MAX6400BS23-T
MAX6400BS22-T
TOP MARK
AAJ
AAI
AAH
AAG
AAF
AAE
AAD
AAC
AAB
AAA
PARTS
MAX6401BS31-T
MAX6401BS30-T
MAX6401BS29-T
MAX6401BS28-T
MAX6401BS27-T
MAX6401BS26-T
MAX6401BS25-T
MAX6401BS24-T
MAX6401BS23-T
MAX6401BS22-T
PARTS
MAX6403BS46-T
MAX6403BS45-T
MAX6403BS44-T
MAX6403BS43-T
MAX6403BS42-T
MAX6403BS41-T
MAX6403BS40-T
MAX6403BS39-T
MAX6403BS38-T
MAX6403BS37-T
MAX6403BS36-T
MAX6403BS35-T
MAX6403BS34-T
MAX6403BS33-T
TOP MARK
ACT
ACS
ACR
ACQ
ACP
ACO
ACN
ACM
ACL
ACK
ACJ
ACI
ACH
ACG
PARTS
MAX6404BS46-T
MAX6404BS45-T
MAX6404BS44-T
MAX6404BS43-T
MAX6404BS42-T
MAX6404BS41-T
MAX6404BS40-T
MAX6404BS39-T
MAX6404BS38-T
MAX6404BS37-T
MAX6404BS36-T
MAX6404BS35-T
MAX6404BS34-T
MAX6404BS33-T
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical reliabil-
ity tests. CSP reliability is integrally linked to the user’s
assembly methods, circuit board material, and usage
environment. The user should closely review these areas
when considering use of a CSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as it is primarily determined by
the wafer-fabrication process.
TOP MARK
ABV
ABU
ABT
ABS
ABR
ABQ
ABP
ABO
ABN
ABM
PARTS
MAX6402BS31-T
MAX6402BS30-T
MAX6402BS29-T
MAX6402BS28-T
MAX6402BS27-T
MAX6402BS26-T
MAX6402BS25-T
MAX6402BS24-T
MAX6402BS23-T
MAX6402BS22-T
TOP MARK
ACF
ACE
ACD
ACC
ACB
ACA
ABZ
ABY
ABX
ABW
TOP MARK
ADH
ADG
ADF
ADE
ADD
ADC
ADB
ADA
ACZ
ACY
ACX
ACW
ACV
ACU
PARTS
MAX6405BS46-T
MAX6405BS45-T
MAX6405BS44-T
MAX6405BS43-T
MAX6405BS42-T
MAX6405BS41-T
MAX6405BS40-T
MAX6405BS39-T
MAX6405BS38-T
MAX6405BS37-T
MAX6405BS36-T
MAX6405BS35-T
MAX6405BS34-T
MAX6405BS33-T
TOP MARK
ADV
ADU
ADT
ADS
ADR
ADQ
ADP
ADO
ADN
ADM
ADL
ADK
ADJ
ADI
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered.
Information on Maxim’s qualification plan, test data, and
recommendations are detailed in the UCSP application
note, which can be found on Maxim’s website at
www.maxim-ic.com.
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