ITF87056DQT データシートの表示（PDF） - Intersil
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ITF87056DQT Datasheet PDF : 13 Pages
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ITF87056DQT
TJ2 = 156.5oC
The transient thermal impedance (ZθJA) is also affected by
varied top copper board area. Figure 21 shows the effect of
copper pad area on single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. Spice and SABER thermal models are provided for
each of the listed pad areas.
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package. Therefore,
CTHERM1 through CTHERM5 and RTHERM1 through
RTHERM5 remain constant for each of the thermal models. A
listing of the model component values is available in Table 1.
200
COPPER BOARD AREA - DESCENDING ORDER
0.02 in2
150 0.14 in2
0.26 in2
0.38 in2
100 0.50 in2
50
0
10-1
100
101
102
103
t, RECTANGULAR PULSE DURATION (s)
FIGURE 21. THERMAL IMPEDANCE vs MOUNTING PAD AREA
8
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