VDD
E
DATA RETENTION MODE
50%
tEFR
VDR > 2.0V
50%
tR
Figure 7. Low VDD Data Retention Waveform
DATA RETENTION CHARACTERISTICS (Pre/Post-Irradiation)
(1 Second Data Retention Test)
SYMBOL
PARAMETER
VDR
VDD for data retention
IDDR 1,2
Data retention current
tEFR 1,3
Chip select to data retention time
tR1 ,3
Operation recovery time
Notes:
1. E = VDD - .2V, all other inputs = VDR or VSS.
2. Data retention current (ID D R) Tc = 25oC.
3. Not guaranteed or tested.
DATA RETENTION CHARACTERISTICS (Pre/Post-Irradiation)
(10 Second Data Retention Test, Tc= -55oC to +125oC for (C) screening
SYMBOL
PARAMETER
V DD 1
tEFR2, 3
VDD for data retention
Chip select to data retention time
tR2, 3
Operation recovery time
Notes:
1. Performed at VDD (min) and VDD (max).
2. E = VSS, all other inputs = VDR or VSS.
3. Not guaranteed or tested.
MINIMUM
2.0
--
0
tAVAV
MAXIMUM UNIT
--
V
2.0
mA
ns
ns
MINIMUM
3.0
0
tAVAV
MAXIMUM UNIT
3.6
V
ns
ns
11