LTC6993MP データシートの表示（PDF） - Linear Technology
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LTC6993MP Datasheet PDF : 26 Pages
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LTC6993-1/LTC6993-2
LTC6993-3/LTC6993-4
PACKAGE DESCRIPTION
DCB Package
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715 Rev A)
0.70 ±0.05
2.00 ±0.10
(2 SIDES)
R = 0.115
R = 0.05
TYP
TYP
4
0.40 ± 0.10
6
3.55 ±0.05
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
PACKAGE
OUTLINE
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50 BSC
1.35 ±0.05
(2 SIDES)
0.200 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3.00 ±0.10 1.65 ± 0.10
(2 SIDES) (2 SIDES)
0.75 ±0.05
0.00 – 0.05
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
3
1
(DCB6) DFN 0405
0.25 ± 0.05
0.50 BSC
1.35 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
0.62
0.95
MAX
REF
2.90 BSC
(NOTE 4)
1.22 REF
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE ID
24
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.95 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
1.90 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
0.01 – 0.10
S6 TSOT-23 0302 REV B
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