LTC4065ATRPBF データシートの表示（PDF） - Linear Technology

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LTC4065ATRPBF

Standalone 750mA Li-Ion Battery Charger in 2 × 2 DFN

Linear Technology 

LTC4065/LTC4065A

APPLICATIO S I FOR ATIO

Furthermore, the voltage at the PROG pin will change

proportionally with the charge current as discussed in the

Programming Charge Current section.

It is important to remember that LTC4065/LTC4065A

applications do not need to be designed for worst-case

thermal conditions since the IC will automatically reduce

power dissipation when the junction temperature reaches

approximately 115°C.

Board Layout Considerations

In order to deliver maximum charge current under all

conditions, it is critical that the exposed metal pad on the

backside of the LTC4065/LTC4065A package is soldered

to the PC board ground. Correctly soldered to a 2500mm2

double-sided 1 oz. copper board the LTC4065/LTC4065A

has a thermal resistance of approximately 60°C/W. Failure

to make thermal contact between the Exposed Pad on the

backside of the package and the copper board will result

in thermal resistances far greater than 60°C/W. As an

example, a correctly soldered LTC4065/LTC4065A can

deliver over 750mA to a battery from a 5V supply at room

temperature. Without a backside thermal connection, this

number could drop to less than 500mA.

VCC Bypass Capacitor

Many types of capacitors can be used for input bypassing;

however, caution must be exercised when using multi-

layer ceramic capacitors. Because of the self-resonant and

high Q characteristics of some types of ceramic capaci-

tors, high voltage transients can be generated under some

start-up conditions, such as connecting the charger input

to a live power source. For more information, refer to

Application Note 88.

PACKAGE DESCRIPTIO

DC Package

6-Lead Plastic DFN (2mm × 2mm)

(Reference LTC DWG # 05-08-1703)

0.675 ±0.05

R = 0.115

TYP

0.56 ± 0.05

4

(2 SIDES)

0.38 ± 0.05

6

2.50 ±0.05

1.15

±0.05

0.61 ±0.05

(2 SIDES)

PACKAGE

OUTLINE

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.25 ± 0.05

0.50 BSC

1.42 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.200 REF

2.00 ±0.10

(4 SIDES)

0.75 ±0.05

0.00 – 0.05

PIN 1

CHAMFER OF

EXPOSED PAD

3

1

(DC6) DFN 1103

0.25 ± 0.05

0.50 BSC

1.37 ±0.05

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

4065f

15

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