LTC2919IMS-5-PBF データシートの表示（PDF） - Linear Technology

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LTC2919IMS-5-PBF

Precision Triple/Dual Input UV, OV and Negative Voltage Monitor

Linear Technology 

LTC2919

PACKAGE DESCRIPTIO

DDB Package

10-Lead Plastic DFN (3mm × 2mm)

(Reference LTC DWG # 05-08-1722 Rev Ø)

0.64 ±0.05

(2 SIDES)

2.55 ±0.05

1.15 ±0.05

0.70 ±0.05

0.25 ± 0.05

0.50 BSC

2.39 ±0.05

(2 SIDES)

PACKAGE

OUTLINE

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

3.00 ±0.10

(2 SIDES)

R = 0.05

TYP

R = 0.115

TYP

6

0.40 ± 0.10

10

2.00 ±0.10

(2 SIDES)

0.75 ±0.05

0.64 ± 0.05

(2 SIDES)

5

0.25 ± 0.05

PIN 1

R = 0.20 OR

0.25 × 45°

CHAMFER

1

(DDB10) DFN 0905 REV Ø

0.50 BSC

0 – 0.05

2.39 ±0.05

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

MS Package

10-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1661 Rev E)

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

10 9 8 7 6

0.497 ± 0.076

(.0196 ± .003)

REF

0.889 ± 0.127

(.035 ± .005)

0.254

(.010)

DETAIL “A”

0° – 6° TYP

4.90 ± 0.152

(.193 ± .006)

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

GAUGE PLANE

12345

0.18

(.007)

0.53 ± 0.152

(.021 ± .006)

DETAIL “A”

1.10

(.043)

MAX

SEATING

PLANE 0.17 – 0.27

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

(.007 – .011)

TYP

0.50

(.0197)

BSC

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.86

(.034)

REF

0.305 ± 0.038

(.0120 ± .0015)

TYP

0.50

(.0197)

BSC

RECOMMENDED SOLDER PAD LAYOUT

0.1016 ± 0.0508

(.004 ± .002)

MSOP (MS) 0307 REV E

2919f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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