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L6208 データシートの表示(PDF) - STMicroelectronics

部品番号
コンポーネント説明
メーカー
L6208
ST-Microelectronics
STMicroelectronics 
L6208 Datasheet PDF : 35 Pages
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L6208
Maximum ratings
Table 3. Thermal data
Symbol
Description
PowerDIP24 SO24 PowerSO36 Unit
Rth-j-pins Maximum thermal resistance junction pins
18
14
-
C/W
Rth-j-case
Rth-j-amb1
Rth-j-amb1
Rth-j-amb1
Rth-j-amb2
Maximum thermal resistance junction case
Maximum thermal resistance junction ambient(1)
Maximum thermal resistance junction ambient(2)
Maximum thermal resistance junction ambient(3)
Maximum thermal resistance junction ambient(4)
-
-
1
C/W
43
51
-
C/W
-
-
35
C/W
-
-
15
C/W
58
77
62
C/W
1. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm2 (with a thickness
of 35 µm).
2. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm).
3. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm),
16 via holes and a ground layer.
4. Mounted on a multilayer FR4 PCB without any heat sinking surface on the board.
DocID7514 Rev 2
5/35
35

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