EMIF04-1502M8(2008) データシートの表示（PDF） - STMicroelectronics

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EMIF04-1502M8
(Rev.:2008)

4-line IPAD™ low capacitance EMI filter and ESD protection in micro QFN package

STMicroelectronics 

Recommendation on PCB assembly

4

Recommendation on PCB assembly

EMIF04-1502M8

4.1

Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 12. Stencil opening dimensions

L

TW

b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

Aspect Ratio

=

W-----

T

≥

1.5

Aspect Area

=

-------L-----×-----W----------

2T(L + W)

≥

0.66

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.

c) Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 13. Recommended stencil window position

5 µm

5 µm

15 µm

0.40

0.20

400 µm

160 µm

190 µm

200 µm

1000 µm

15 µm

0.40

50 µm

680 µm

50 µm

160 µm

0.60

0.25

2.10

1.00

Footprint

Stencil window

Footprint

6/10

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