EMIF04-1502M8(2008) データシートの表示（PDF） - STMicroelectronics

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EMIF04-1502M8
(Rev.:2008)

4-line IPAD™ low capacitance EMI filter and ESD protection in micro QFN package

STMicroelectronics 

Package information

3

Package information

EMIF04-1502M8

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Table 3.

QFN 1.7 x 1.5 package dimensions

D

N

Ref

Dimensions

Millimeters

inches

E

MIN TYP MAX MIN TYP MAX

12

A

A1

12

e

L

k

b

A 0.50 0.55 0.60 0.20 0.22 0.24

A1 0.00 0.02 0.05 0.00 0.01 0.02

b 0.15 0.18 0.25 0.06 0.07 0.10

D

1.70

0.67

D2 0.9 1.00 1.10 0.35 0.39 0.43

E

1.50

0.59

E2 0.30 0.40 0.50 0.12 0.16 0.24

e

0.40

0.16

k 0.20

0.08

L 0.25 0.30 0.35 0.10 0.12 0.14

Figure 9. Footprint

Figure 10. Marking

0.40

0.40

0.20

0.60

0.25

2.10

Dot: Pin 1 Identification

XX= Marking

XX

1.00

4/10

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