EL5411T
Power Supply Bypassing and Printed Circuit
Board Layout
The EL5411T can provide gain at high frequency, so good
printed circuit board layout is necessary for optimum
performance. Ground plane construction is highly
recommended, trace lengths should be as short as possible
and the power supply pins must be well bypassed to reduce
any risk of oscillation.
For normal single supply operation (the VS- pin is connected
to ground) a 4.7µF capacitor should be placed from VS+ to
ground, then a parallel 0.1µF capacitor should be connected
as close to the amplifier as possible. One 4.7µF capacitor
may be used for multiple devices. For dual supply operation
the same capacitor combination should be placed at each
supply pin to ground.
It is highly recommended that EL5411T exposed thermal pad
packages should always have the pad connected to the
lowest potential, VS-, to optimize thermal and operating
performance. PCB vias should be placed below the device’s
exposed thermal pad to transfer heat to the VS- plane and
away from the device.
Revision History
DATE
10/8/09
REVISION
FN6837.1
8/21/09
FN6837.0
CHANGE
Updated Ordering Information by removing “contact factory for availability”.
add "vs FREQUENCY" to the plot titles in Fig 14,15,18,21,22,23,24:
Fig 21: changed y-axis label to read "CMRR (dB)"
Fig 22: changed y-axis label to read "PSRR (dB)"
Fig 26: changed label to read "STEP SIZE vs SETTLING TIME"
Changed 1st sentence in pages 1 and 12 from “The EL5411T is a low power, high voltage rail-
to-rail input-output amplifier” to “The EL5411T is a high voltage rail-to-rail input-output amplifier
with low power consumption”.
Updated package outline drawing M14.173A to add land pattern and move dimensions from
table onto drawing
Initial Release.
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14
FN6837.1
October 8, 2009