PRELIMINARY
CY14B101P
SPI Operating Features
Power Up
Power up is defined as the condition when the power supply is
turned on and VCC crosses Vswitch voltage. During this time, the
Chip Select (CS) must be enabled to follow the VCC voltage.
Therefore, CS must be connected to VCC through a suitable pull
up resistor. As a built in safety feature, Chip Select (CS) is both
edge sensitive and level sensitive. After power up, the device is
not selected until a falling edge is detected on Chip Select (CS).
This ensures that Chip Select (CS) must have been HIGH,
before going Low to start the first operation.
As described earlier, nvSRAM performs a Power Up Recall
operation after power up and therefore, all memory accesses are
disabled for tRECALL duration after power up. The HSB pin can
be probed to check the ready/busy status of nvSRAM after power
up.
Power On Reset
A Power On Reset (POR) circuit is included to prevent
inadvertent writes. At power up, the device does not respond to
any instruction until the VCC reaches the Power On Reset
threshold voltage (VSWITCH). After VCC transitions the POR
threshold, the device is internally reset and performs a Power Up
Recall operation. The device is in the following state after POR:
■ Deselected (after Power up, a falling edge is required on Chip
Select (CS) before any instructions are started).
■ Standby Power mode
■ Not in the Hold Condition
■ Status register state:
❐ Write Enable (WEN) bit is reset to 0.
❐ WPEN, BP1, BP0 unchanged from previous power down
The WPEN, BP1, and BP0 bits of the Status Register are nonvol-
atile bits and remain unchanged from the previous power down.
Before selecting and issuing instructions to the memory, a valid
and stable VCC voltage must be applied. This voltage must
remain valid until the end of the transmission of the instruction.
Power Down
At power down (continuous decay of VCC), when VCC drops from
the normal operating voltage and below the VSWITCH threshold
voltage, the device stops responding to any instruction sent to it.
If a write cycle is in progress during power down, it is allowed
tDELAY time to complete after Vcc transitions below VSWITCH.
After this, all memory accesses are inhibited and a conditional
AutoStore operation is performed (AutoStore is not performed if
no writes have happened since last RECALL cycle). This feature
prevents inadvertent writes to nvSRAM from happening during
power down.
However, to avoid the possibility of inadvertent writes during
power down, ensure that the device is deselected and is in
Standby Power Mode, and the Chip Select (CS) follows the
voltage applied on VCC.
Active Power and Standby Power Modes
When Chip Select (CS) is LOW, the device is selected, and is in
the Active Power mode. The device consumes ICC current, as
specified in DC Electrical Characteristics on page 23. When Chip
Select (CS) is HIGH, the device is deselected and the device
goes into the Standby Power mode if a STORE or RECALL cycle
is not in progress. If a STORE/RECALL cycle is in progress, the
device goes into the Standby Power Mode after the
STORE/RECALL cycle is completed. In the Standby Power
mode the current drawn by the device drops to ISB.
SPI Functional Description
The CY14B101P uses an 8-bit instruction register. Instructions
and their operation codes are listed in Table 2. All instructions,
addresses, and data are transferred with the MSB first and start
with a HIGH to LOW CS transition. There are, in all, 12 SPI
instructions which provide access to most of the functions in
nvSRAM. Further, the WP and HOLD pins provide additional
functionality driven through hardware.
Table 2. Instruction Set
Instruction Instruction
Category
Name
WREN
Status
Register
Instructions
WRDI
RDSR
WRSR
SRAM
Read/Write
Instructions
READ
WRITE
RTC
Read/Write
Instructions
WRTC
RDRTC
Special NV
Instructions
Reserved
STORE
RECALL
ASENB
ASDISB
- Reserved -
Opcode
0000 0110
0000 0100
0000 0101
0000 0001
0000 0011
0000 0010
0001 0010
0001 0011
0011 1100
0110 0000
0101 1001
0001 1001
0001 1110
Operation
Set Write Enable
Latch
Reset Write
Enable Latch
Read Status
Register
Write Status
Register
Read Data From
Memory Array
Write Data To
Memory Array
Write RTC
Registers
Read RTC
Registers
Software Store
Software Recall
AutoStore Enable
AutoStore Disable
Reserved for
Internal use
The SPI instructions in CY14B101P are divided based on their
functionality in following types:
❐ Status Register Access: WRSR and RDSR instructions
❐ Write Protection Functions: WREN and WRDI instructions
along with WP pin and WEN, BP0 and BP1 bits
❐ SRAM memory Access: READ and WRITE instructions
❐ RTC access: RDRTC and WRTC instructions
❐ nvSRAM special instructions: STORE, RECALL, ASENB and
ASDISB
Document #: 001-44109 Rev. *C
Page 7 of 33
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