CLC2005ISO8 データシートの表示（PDF） - Cadeka Microcircuits LLC.
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CLC2005ISO8 Datasheet PDF : 13 Pages
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Data Sheet
Mechanical Dimensions
SOIC-8 Package
D
e
X
CL
CL E H
Pin No. 1
B
A A1
DETAIL-A
0.015±0.004 x 45°
θ1
θ2
Gauge Plane
Seating Plane
L
SYMBOL
A
A1
B
D
E
H
e
C
L
X
θ1
θ2
SOIC-8
MIN
MAX
0.054
0.068
0.004
0.0098
0.014
0.019
0.189
0.196
0.150
0.157
0.229
0.244
0.050 BSC
0.0075 0.0098
0.016
0.034
0.0215 Ref
0°
8°
7° BSC
DETAIL-A
C
NOTE:
1. All dimensions are in inches.
2. Lead coplanarity should be 0" to 0.004" max.
3. Package surface finishing: VDI 24~27
4. All dimension excluding mold flashes.
5. The lead width, B to be determined at 0.0075"
from the lead tip.
For additional information regarding our products, please visit CADEKA at: cadeka.com
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T: 970.663.5452
T: 877.663.5452 (toll free)
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CADEKA reserves the right to make changes to any products and services herein at any time without notice. CADEKA does not assume any
responsibility or liability arising out of the application or use of any product or service described herein, except as expressly agreed to in
writing by CADEKA; nor does the purchase, lease, or use of a product or service from CADEKA convey a license under any patent rights,
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Copyright ©2007-2009 by CADEKA Microcircuits LLC. All rights reserved.
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