Product specification 16
Surface-Mount Ceramic Multilayer Capacitors General Purpose & High Cap. X7R 6.3 V to 50 V 20
TEST
Temperature
Characteristic
TEST METHOD PROCEDURE
IEC 60384- 4.6
21/22
Class 2:
Between minimum and maximum temperature
X7R: -55 °C to +125 °C
Normal Temperature: 20 °C
REQUIREMENTS
<General Purpose series>
∆C/C
Class 2:
X7R: ±15%
<High Capacitance series>
∆C/C
Class 2:
X7R: ±15%
Adhesion
4.7 A force applied for 10 seconds to the line joining the
terminations and in a plane parallel to the substrate
Force
size ≥ 0603: 5N
size = 0402: 2.5N
size = 0201: 1N
Bond Strength
of Plating on
End Face
4.8 Mounting in accordance with IEC 60384-22 paragraph
4.3
Conditions: bending 1 mm at a rate of 1 mm/s, radius jig
340 mm
No visible damage
<General Purpose series>
∆C/C
Class2:
X7R: ±10%
<High Capacitance series>
∆C/C
Class2:
X7R: ±10%
Resistance to
Soldering Heat
4.9 Precondition: 150 +0/–10 °C for 1 hour, then keep for
24 ±1 hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1
minute
Preheating: for size >1206: 100 °C to 120 °C for 1
minute and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Dissolution of the end face plating shall
not exceed 25% of the length of the
edge concerned
<General Purpose series>
∆C/C
Class2:
X7R: ±10%
<High Capacitance series>
∆C/C
Class2:
X7R: ±10%
D.F. within initial specified value
Rins within initial specified value
Oct 13, 2011 V.8
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