APW7145
Pin Configuration
NC 1
VIN 2
AGND 3
FB 4
APW7145
9
LX
SOP-8P
(Top View)
8 PGND
7 LX
6 EN
5 COMP
APW7145
NC 1
VIN 2
AGND 3
FB 4
8 PGND
7 LX
6 EN
5 COMP
DFN4x4-8
(Top View)
The Pin 7 must be connected to the Exposed Pad
Ordering and Marking Information
APW7145
APW7145 KA :
APW7145
XXXXX
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
KA : SOP-8P QA: DFN4x4-8
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
XXXXX - Date Code
APW7145 QA :
APW7145
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VIN
VIN Supply Voltage (VIN to AGND)
-0.3 ~ 15
V
VLX
LX to GND Voltage
> 100ns
< 100ns
-1 ~ VIN+1
V
- 5 ~ VIN+5
PGND to AGND Voltage
-0.3 ~ +0.3
V
EN to AGND Voltage
-0.3 ~ VIN+0.3
V
FB, COMP to AGND Voltage
-0.3 ~ 6
V
PD
Power Dissipation
Internally Limited
W
Maximum Junction Temperature
150
oC
TSTG
Storage Temperature
-65 ~ 150
oC
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
260
oC
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability
Copyright © ANPEC Electronics Corp.
2
Rev. A.7 - Mar., 2011
www.anpec.com.tw