AP2141FM データシートの表示（PDF） - Diodes Incorporated.

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AP2141FM

0.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Diodes Incorporated. 

AP2141/AP2151

0.5A SINGLE CHANNEL CURRENT-LIMITED POWER

SWITCH

Electrical Characteristics

(TA = 25°C, VIN = +5.0V, unless otherwise stated)

Symbol

Parameter

Test Conditions

Min Typ. Max Unit

VUVLO Input UVLO

Rload=1kΩ

1.6 1.9 2.5 V

ISHDN Input Shutdown Current

Disabled, IOUT= 0

0.5 1 μA

IQ Input Quiescent Current

Enabled, IOUT= 0

45 70 μA

ILEAK Input Leakage Current

Disabled, OUT grounded

1 μA

IREV Reverse Leakage Current

Disabled, VIN= 0V, VOUT= 5V, IREV at VIN

1

μA

RDS(ON) Switch on-resistance

VIN = 5V,

IOUT= 0.5A

SOT25, MSOP-8L-EP,

TA = 25°C SOP-8L

DFN2018-6

-40°C ≤ TA ≤ 85°C

95 115

90 110

140 mΩ

VIN = 3.3V, TA = 25°C

IOUT= 0.5A -40°C ≤ TA ≤ 85°C

120 140

170

ISHORT Short-Circuit Current Limit Enabled into short circuit, CL=22μF

0.6

A

ILIMIT Over-Load Current Limit

VIN= 5V, VOUT= 4.8V, CL=22μF, -40°C ≤ TA ≤85°C 0.6 0.8 1.0 A

ITrig

Current limiting trigger

threshold

Output Current Slew rate (<100A/s) , CL=22μF

1.0

A

VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V

0.8 V

VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V

2

V

ISINK EN Input leakage

VEN = 5V

1 μA

TD(ON) Output turn-on delay time

CL=1μF, Rload=10Ω

0.05

ms

TR Output turn-on rise time

CL=1μF, Rload=10Ω

0.6 1.5 ms

TD(OFF) Output turn-off delay time

CL=1μF, Rload=10Ω

0.01

ms

TF Output turn-off fall time

CL=1μF, Rload=10Ω

0.05 0.1 ms

RFLG FLG output FET on-resistance IFLG =10mA

20 40 Ω

TBlank FLG blanking time

CIN=10uF, CL=22μF

4

7 15 ms

TSHDN Thermal Shutdown Threshold Enabled, Rload=1kΩ

140

°C

THYS Thermal Shutdown Hysteresis

25

°C

SOP-8L (Note 4)

110

oC/W

θJA

Thermal Resistance

Junction-to-Ambient

MSOP-8L-EP (Note 5)

SOT25 (Note 6)

60

oC/W

157

oC/W

DFN2018-6 (Note 7)

70

oC/W

Notes:

4. Test condition for SOP-8L: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.

5. Test condition for MSOP-8L-EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top

layer and thermal vias to bottom layer ground plane.

6. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.

7. Test condition for DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias

to bottom layer 1.0”x1.4” ground plane.

AP2141/AP2151 Rev. 6

DS31562

5 of 19

www.diodes.com

JUNE 2009

© Diodes Incorporated

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