AM7969-125 データシートの表示（PDF） - Advanced Micro Devices

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AM7969-125

TAXIchip Integrated Circuits (Transparent Asynchronous Xmitter-Receiver Interface)

Advanced Micro Devices 

Assembly/Packaging:

Assembly Location:

Ld. Frame Material:

Bond Wire:

Bonding Method:

Die Attach:

Molding Compound:

Lead Finish

Thermal Impedance:

θJA

TX :

RX:

θJC

TX, RX:

1 socketed

2 surface mounted

AMD

CerDIP (CD 028)

LCC (CLT028)

Manila

CD: Alloy 42

1.25 mil

Al/Si (1% Si)

Ultrasonic

Ag Glass

N/A

PLCC (PL 028)

Bangkok

Copper

1.25 mil Au

Ball Bonding

Ag Filled Epoxy

Sumitomo 6300H

CD 028 Comm.:

CD 028 Mil.:

CLT028 Mil.:

PL 028:

Tin Plate

Solder Dip

Solder Dip

Solder Plate

CD 0281

41°C/W

43°C/W

4°C/W

CLT0282

n/a

n/a

10°C/W

PL 0282

53°C/W

52°C/W

12°C/W

TAXIchip Integrated Circuits Technical Manual

121

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