
ASAHI KASEI
PACKAGE
28pin VSOP (Unit: mm)
0.675
28
*9.8±0.2
15
A
[AK4525]
1.25±0.2
1
0.22±0.1
14
0.65
Detail A
+0.1
0.15-0.05
0.1±0.1
Seating Plane
0.10
NOTE: Dimension "*" does not include mold flash.
n Material & Lead finish
Package molding compound: Epoxy
Lead frame material:
Cu
Lead frame surface treatment: Solder plate
0-10°
MS0053-E-00
- 17 -
2000/9