ADP1754ACPZ-1.2-R7 データシートの表示（PDF） - Analog Devices

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ADP1754ACPZ-1.2-R7

1.2 A, Low VIN, Low Dropout Linear Regulator

Analog Devices 

ADP1754/ADP1755

140

MAX JUNCTION

TEMPERATURE

120

LOAD = 1.2A

LOAD = 800mA

100

80

LOAD = 400mA

60

LOAD = 200mA

40

LOAD = 100mA

20

LOAD = 10mA

0

0.25

0.75

1.25

1.75

VIN – VOUT (V)

2.25

2.75

Figure 36. 6400 mm2 of PCB Copper, TA = 25°C, LFCSP

140

MAX JUNCTION

TEMPERATURE

120

LOAD = 1.2A

100

80

LOAD = 800mA

LOAD = 400mA

LOAD = 200mA

60

LOAD = 100mA

40

LOAD = 10mA

20

0

0.25

0.75

1.25

1.75

VIN – VOUT (V)

2.25

2.75

Figure 37. 500 mm2 of PCB Copper, TA = 25°C, LFCSP

140

MAX JUNCTION

TEMPERATURE

120

LOAD = 1.2A

100

LOAD =

800mA

LOAD = 400mA

80

LOAD = 200mA

60

LOAD = 100mA

40

20

LOAD = 10mA

0

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

Figure 38. 0 mm2 of PCB Copper, TA = 25°C, LFCSP

Data Sheet

140

MAX JUNCTION

TEMPERATURE

120

LOAD = 1.2A

100

80

LOAD = 800mA

LOAD = 400mA

LOAD = 200mA

60

LOAD = 10mA

40

LOAD = 100mA

20

0

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

Figure 39. 6400 mm2 of PCB Copper, TA = 50°C, LFCSP

140

LOAD = 1.2A

120

MAX JUNCTION

TEMPERATURE

LOAD = 800mA

100

LOAD = 400mA

80

LOAD = 200mA

60

LOAD = 100mA

LOAD = 10mA

40

20

0

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

Figure 40. 500 mm2 of PCB Copper, TA = 50°C, LFCSP

140

LOAD = 1.2A

MAX JUNCTION

TEMPERATURE

120

LOAD =

800mA

LOAD = 400mA

100

LOAD = 200mA

80

LOAD = 100mA

60

LOAD = 10mA

40

20

0

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

Figure 41. 0 mm2 of PCB Copper, TA = 50°C, LFCSP

In cases where the board temperature is known, the thermal

characterization parameter, ΨJB, can be used to estimate the

junction temperature rise. Maximum junction temperature (TJ)

is calculated from the board temperature (TB) and power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(7)

Rev. F | Page 16 of 20

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