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ADP1196(Rev0) データシートの表示(PDF) - Analog Devices

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ADP1196 Datasheet PDF : 12 Pages
First Prev 11 12
ADP1196
OUTLINE DIMENSIONS
1.000
0.950
0.900
2
1
BALL A1
IDENTIFIER
0.675
0.595
0.515
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
A
1.500
1.450
1.00
REF
B
1.400
C
0.50
BSC
0.380
0.355
0.330
0.50 BSC
BOTTOM VIEW
(BALL SIDE UP)
COPLANARITY
0.075
SEATING
PLANE
0.345
0.295
0.245
0.270
0.240
0.210
Figure 28. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
ADP1196ACBZ-R7
−40°C to +85°C
Package Description
6-Ball Wafer Level Chip Scale Package [WLCSP]
1 Z = RoHS Compliant Part.
Data Sheet
Package Option
CB-6-2
Branding
BW
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D11260-0-6/13(0)
Rev. 0 | Page 12 of 12

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