ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Min
VDD to DGND
–0.3
PLL_ VDD to PGND
–0.3
OD VDD to DGND
–0.3
INVDD to DGND
ODVDD
Digital Inputs
DGND – 0.3
Maximum Junction Temperature
Storage Temperature Range
–65
Soldering (10 sec)
Max
Unit
+3.0
V
+3.0
V
+6.0
V
+6.0
V
INVDD + 0.3
V
135
°C
+150
°C
300
°C
AD1940
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 9. Package Characteristics
Parameter
θJA Thermal Resistance (Junction-to-Ambient)
θJC Thermal Resistance (Junction-to-Case)
Min Typ
Max
Unit
72
°C/W
19.5
°C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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