7546 Group
Table 1 Performance overview
Parameter
Function
Number of basic instructions
71
Instruction execution time
0.25 µs
(Minimum instruction, oscillation frequency 8 MHz: double-speed mode)
Oscillation frequency
8 MHz (max.)
Memory sizes
ROM
8 K to 16 K bytes
RAM
384 to 512 bytes
I/O port
P0, P1, P2, P3
•8-bit ✕ 1, 6-bit ✕ 2, 5-bit ✕ 1
Interrupts
18 sources, 16 vectors
Timer
•8-bit ✕ 2, 16-bit ✕ 2
Output compare
4 channel
Input capture
2 channel
Serial interface
8-bit ✕ 2 (UART or clock synchronous)
A/D converter
10-bit ✕ 6 channel
Watchdog timer
16-bit ✕ 1
Clock generating circuit
Built-in
(external ceramic resonator or quartz-crystal oscillator, RC oscillation available)
(Low consumption current by on-chip oscillator available)
Power source
Double-speed mode At 8MHz oscillation 4.5 to 5.5 V
voltage
At 6.5MHz oscillation 4.0 to 5.5 V
(at ceramic
At 2MHz oscillation 2.4 to 5.5 V
resonance)
At 1MHz oscillation 2.2 to 5.5 V
High-speed mode At 8MHz oscillation 4.0 to 5.5 V
Middle-speed mode At 4MHz oscillation 2.4 to 5.5 V
At 2MHz oscillation 2.2 to 5.5 V
Power source
High-speed mode At 4MHz oscillation 4.0 to 5.5 V
voltage
Middle-speed mode At 2MHz oscillation 2.4 to 5.5 V
(at RC oscillation)
At 1MHz oscillation 2.2 to 5.5 V
Power source voltage (at on-chip oscillation)
1.8 to 5.5 V
Power dissipation
29.5 mW (Typ.)
Operating temperature range
-20 to 85 °C
Device structure
CMOS sillicon gate
Package
32-pin plastic molded SDIP/LQFP
36-pin plastic molded WQFN
Rev.1.21 Nov 15, 2006 page 4 of 93
REJ03B0160-0121