74LVC1G32
SINGLE 2 INPUT POSITIVE OR GATE
Package Characteristics (All typical values are at Vcc = 3.3V, TA = 25°C)
Symbol
Parameter
θJA
Thermal Resistance
Junction-to-Ambient
θJC
Thermal Resistance
Junction-to-Case
Test Conditions
SOT25
SOT353
SOT553
X2-DFN1010-6
X2-DFN1410-6
SOT25
SOT353
SOT553
X2-DFN1010-6
X2-DFN1410-6
VCC
(Note 4)
(Note 4)
Min
Typ. Max Unit
204
371
oC/W
231
445
460
52
143
oC/W
105
250
265
Notes: 4. Test condition for SOT25, SOT353, SOT553, X2-DFN1410-6 and X2-DFN1010-6: Device mounted on FR-4 substrate PC board, 2oz copper, with
minimum recommended pad layout.
Switching Characteristics
Figure 1 Typical Values at TA = 25 ºC and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V.
Parameter From
To
Input Output
VCC
TA = -40ºC to 85ºC
Min
Typ.
Max
TA = -40ºC to 125ºC
Unit
Min
Max
1.8V ± 0.15V
1.0
3.1
8.0
1.0
10.5
2.5V ± 0.2V
0.5
2.1
5.5
0.5
7.0
tpd
A or B
Y
2.7V
0.5
2.5
5.5
0.5
7.0
ns
3.3V ± 0.3V
0.5
2.1
4.5
0.5
6.0
5.0V ± 0.5V
0.5
1.7
4.0
0.5
5.5
Operating Characteristics
TA = 25 ºC
Parameter
Power dissipation
Cpd
capacitance
Test
Conditions
f = 10 MHz
VCC = 1.8V
Typ.
20
VCC = 2.5V
Typ.
20
VCC = 3.3V
Typ.
21
VCC = 5V
Typ.
22
Unit
pF
74LVC1G32
Document number: DS32200 Rev. 6 - 2
5 of 12
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February 2012
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