NXP Semiconductors
Earless flanged ceramic package; 2 leads
BLF2425M8L(S)140
Power LDMOS transistor
SOT502B
D
A
F
3
D1
D
L
H U2
U1
1
c
E1
E
2
b
w2 M D M
Q
0
5 10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
b
c
D D1
E
E1
F
H
L
Q
U1 U2 w2
mm
4.72 12.83 0.15 20.02 19.96 9.50
3.43 12.57 0.08 19.61 19.66 9.30
9.53
9.25
1.14 19.94 5.33
0.89 18.92 4.32
1.70
1.45
20.70
20.45
9.91
9.65
0.25
inches
0.186
0.135
0.505
0.495
0.006
0.003
0.788 0.786
0.772 0.774
0.374
0.366
0.375
0.364
0.045
0.035
0.785
0.745
0.210
0.170
0.067
0.057
0.815
0.805
0.390
0.380
0.010
OUTLINE
VERSION
IEC
SOT502B
REFERENCES
JEDEC
JEITA
Fig 6. Package outline SOT502B
BLF2425M8L140_2425M8LS140
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 27 August 2013
EUROPEAN
PROJECTION
ISSUE DATE
07-05-09
12-05-02
© NXP B.V. 2013. All rights reserved.
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