Data Sheet
OUTLINE DIMENSIONS
AD5722R/AD5732R/AD5752R
7.90
5.02
7.80
5.00
7.70
4.95
24
13
4.50
4.40
4.30
6.40 BSC
EXPOSED
PAD
(Pins Up)
3.25
3.20
3.15
1
12
TOP VIEW
1.05
1.20 MAX
1.00
0.80
0.15
0.05
SEATING
PLANE
0.65
BSC
0.30
0.19
0.10 COPLANARITY
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
8°
FUNCTION DESCRIPTIONS
0°
SECTION OF THIS DATA SHEET.
0.20
0.09
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-ADT
Figure 53. 24-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]
(RE-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD5722RBREZ
AD5722RBREZ-REEL7
AD5732RBREZ
AD5732RBREZ-REEL7
AD5752RBREZ
AD5752RBREZ-REEL7
1 Z = RoHS Compliant Part.
Resolution
12
12
14
14
16
16
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
INL
±1 LSB
±1 LSB
±4 LSB
±4 LSB
±16 LSB
±16 LSB
Package Description
24-Lead TSSOP_EP
24-Lead TSSOP_EP
24-Lead TSSOP_EP
24-Lead TSSOP_EP
24-Lead TSSOP_EP
24-Lead TSSOP_EP
Package Option
RE-24
RE-24
RE-24
RE-24
RE-24
RE-24
©2008–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06466-0-2/17(F)
Rev. F | Page 32 of 32