S70WS512N00BAWA20 データシートの表示（PDF） - Spansion Inc.

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S70WS512N00BAWA20

Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory

Spansion Inc. 

S70WS512N00 Based MCPs

Same-Die Stacked Multi-Chip Product (MCP)

512 Megabit (32M x 16 bit) CMOS

1.8 Volt-only Simultaneous Read/Write,

Burst-mode Flash Memory

ADVANCE

INFORMATION

General Description

The S70WS512N Series is a product line of stacked Multi-Chip Product (MCP) packages and con-

sists of two S29WS-N flash memory die.

Distinctive Characteristics

MCP Features

„ Power supply voltage of 1.7 V to 1.95 V

„ Burst Speed: 54 MHz, 66 MHz

„ Package

— 8 x 11.6 mm

„ Operating Temperature

— Wireless, –25°C to +85°C

Publication Number S70WS512N00_00 Revision A Amendment 0 Issue Date March 14, 2005

This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do

not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.

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