MCP601/1R/2/3/4
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V and VSS = GND.
Parameters
Sym Min Typ Max Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
—
+85
°C Industrial temperature parts
TA
-40
— +125 °C Extended temperature parts
Operating Temperature Range
TA
-40
— +125 °C Note
Storage Temperature Range
TA
-65
— +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT23
θJA
—
256
— °C/W
Thermal Resistance, 6L-SOT23
θJA
—
230
— °C/W
Thermal Resistance, 8L-PDIP
θJA
—
85
— °C/W
Thermal Resistance, 8L-SOIC
θJA
—
163
— °C/W
Thermal Resistance, 8L-TSSOP
θJA
—
124
— °C/W
Thermal Resistance, 14L-PDIP
θJA
—
70
— °C/W
Thermal Resistance, 14L-SOIC
θJA
—
120
— °C/W
Thermal Resistance, 14L-TSSOP θJA
—
100
— °C/W
Note: The Industrial temperature parts operate over this extended range, but with reduced performance. The
Extended temperature specs do not apply to Industrial temperature parts. In any case, the internal Junction
temperature (TJ) must not exceed the absolute maximum specification of 150°C.
1.1 Test Circuits
The test circuits used for the DC and AC tests are
shown in Figure 1-2 and Figure 1-2. The bypass
capacitors are laid out according to the rules discussed
in Section 4.5 “Supply Bypass”.
VIN
RN
VDD/2 RG
VDD 0.1 µF 1 µF
MCP60X
RF
VOUT
CL RL
VL
FIGURE 1-2:
AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
VDD/2
RN
VIN RG
VDD 0.1 µF 1 µF
MCP60X
RF
VOUT
CL RL
VL
FIGURE 1-3:
AC and DC Test Circuit for
Most Inverting Gain Conditions.
DS21314G-page 4
© 2007 Microchip Technology Inc.