1Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – Absolute Ratings
Table 7: Thermal Impedance
Die Revision Package
Substrate
(pcb)
θ JA (°C/W)
θ JA (°C/W)
θ JA (°C/W)
Airflow = 0m/s Airflow = 1m/s Airflow = 2m/s θ JB (°C/W) θ JC (°C/W)
2-layer
72.5
55.5
49.5
35.6
5.7
60-ball
H1
4-layer
54.5
45.7
42.3
35.2
84-ball
2-layer
68.8
52.0
46.5
32.5
5.6
4-layer
51.3
42.7
39.6
32.3
M1
60-ball Low Conductivity
High Conductivity
85.4
63.2
70.6
56.1
64.5
42.8
11.7
52.8
Low Conductivity
80.8
67.0
61.6
84-ball High Conductivity
59.7
53.3
50.7
44.7
11.7
Note: 1. Thermal resistance data is based on a number of samples from multiple lots and should
be viewed as a typical number.
PDF: 09005aef8565148a
1GbDDR2.pdf – Rev. AA 07/14 EN
25
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