
Package Outline Unit : mm
M-290
0.8 ± 0.1
1T417
Mark
b
10° MAX
SONY CODE
EIAJ CODE
JEDEC CODE
M-290
c
BASE METAL WITH PLATING
c
0.11 ± 0.005
0.11
+
–
0.05
0.01
b
0.3 ± 0.025
0.3
+
–
0.05
0.02
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER
0.002g
1 X7 2
1 : Cathode
2 : Anode
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