HCTS245DMSR データシートの表示（PDF） - Intersil

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HCTS245DMSR

Radiation Hardened Octal Bus Transceiver, Three-State, Non-Inverting

Intersil 

Die Characteristics

DIE DIMENSIONS:

124 x 110 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS245MS

HCTS245MS

A0 (2)

A1 (3)

A2 (4)

A3 (5)

A4 (6)

A5 (7)

(18) B0

(17) B1

(16) B2

(15) B3

(14) B4

(13) B5

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS245 is TA14417A.

Spec Number 518615

622

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