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MSM82C59A-2GS データシートの表示(PDF) - Oki Electric Industry

部品番号
コンポーネント説明
メーカー
MSM82C59A-2GS
OKI
Oki Electric Industry 
MSM82C59A-2GS Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
¡ Semiconductor
SSOP32-P-430-1.00-K
MSM82C59A-2RS/GS/JS
(Unit : mm)
Mirror finish
Notes for Mounting the Surface Mount Type Package
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.60 TYP.
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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