FEATURES
• Ultra compact LLP1006-2L package
• Low package height < 0.4 mm
• 1-line ESD-protection
• Low leakage current < 0.5 μA
• Low load capacitance CD = 15 pF
   (VR = 2.5 V; f = 1 MHz)
• ESD-protection acc. IEC 61000-4-2
   ± 30 kV contact discharge
   ± 30 kV air discharge
• High surge current acc. IEC61000-4-5 IPP > 3.5 A
• Soldering can be checked by standard vision inspection.
   No X-ray necessary
• Pin plating NiPdAu (e4) no whisker growth
• e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)
• Material categorization: For definitions of compliance
   please see www.vishay.com/doc?99912