Features:
1. Meets IEEE 802.3 and ANSI X.3.263 standards including 350uH OCL with 8mA bias.
2. Designed for reflow soldering at temperature 230±5°C.
3. Compact footprint for use in the most space restrictive applications.
4. Turns Ratio tolerance: ±5%
5. Operating temperature: -40°C to +85°C